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| @Ob3/4EAeN/|--1/2q MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 LED FLASH ON/OFF, OSH ANDOM/SEQUENCE FEATURES \aO-z E OFF : ON/OFF toggle. Default ON. ON/ E OSH : One-Shot. E RD/SEQ : Random/Sequence. Default RD. E Power-on blinking. M1600A 6 LED {O IC P/N M1600A-1 M1600A-2 M1600A-3 M1600A-4 M1600A-4A M1600A-4B M1600A-5 M1600A-6 (KHz) Rosc Fosc Ext. Int. Ext. Int. 65 Int. 85 Int. 85 Ext. Int. Duty 1/6 1/12 1/6 1/12 1/12 1/12 1/6 1/12 OSH Cycle 32 32 32 32 32 32 16 8 LED Flash L1/L6 L6/L1 L1/L6 L6/L1 L6/L1 L6/L1 L1/L6 L6/L1 LED (Hz) Driver FLED 2/3 2.6 2/3 2.6 1 2.6 1 2.6 1 3.5 1 3.5 1 2.6 1 2.6 POWER ON ON ON ON ON OFF ON ON APPLICATION ~AI E Arcade game system, Toys. ELECTRICAL CHARACTERISTICS q(R)W(R)ae Characteristics u@qA Operating Voltage u@qy Operating Current ARAqy Quiescent Current AEqy Driving Current (R)AuAWvOscillator Frequency u@*Ax Operating Temperature Sym. VDD IOP ISB IOL FOSC Temp. Min. w w w ( @VDD=3V unless otherwise specified ) Max. 3.5 0.5 5 w w 60 Unit V mA gA mA KHz J @ VDS=1.2V ExternalO 30% No load REMARKS Typ. 3 0.1 1 w 65 25 20 w 0 APPLICATION DIAGRAM N|OqoI VDD L1 L2 L3 L4 L5 L6 M1600AP VSS L6 L5 X Rosc Y ON/OFF TEST RD/SEQ VDD OSH Y 1 16 1.12 x 1.12 mm2 (c) =VDD M1600A VSS L4 L3 L2 L1 OSH RD/SEQ ON/OFF X 8 9 VDD *All specs and applications shown above subject to change without prior notice. ( HWqoIW(R)aeENN|O ,1/2qow|ae-x) 1/2 2004-10-11 @Ob3/4EAeN/|--1/2q MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 LED FLASH ON/OFF, OSH ANDOM/SEQUENCE PAD ASSIGNMENT & POSITION M1600A 6 LED {O IC 5 4 3 2 1 14 Y X ( 0,0 ) 6 13 7 8 9 10 11 12 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 NAME OSH VDD RD/SEQ TEST ON/OFF VSS L6 L5 L4 L3 L2 L1 X Y X 433.5 252.75 99 -120 -429 -430.5 -396.75 -238.5 -80.25 78 236.25 394.5 433.5 433.5 UNIT : um Y 432.75 432.75 432.75 431.25 432.75 -54 -431.25 -431.25 -431.25 -431.25 -431.25 -431.25 -51.75 -279 * CHIP SIZE ~ 1.12 x 1.12 mm2 * IC substrate should be connected to VDD in PCB (PCB WIC * VDD) ( HWqoIW(R)aeENN|O ,1/2qow|ae-x) 2/2 2004-10-11 |
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